NDLI: Value added technology development on microinterconnect flex circuit

Content Provider	IEEE Xplore Digital Library
Author	Zhang Ke
Copyright Year	2003
Description	Author affiliation: 3M Asia Pacific Innovation Center, Singapore, Singapore (Zhang Ke)
Abstract	To develop a conductive polymer formulation which can be printed through an automatic reel-to-reel process to form a thin film (0.1 to 25 /spl mu/m) on insulated materials. The materials can be but not limited to, polymers, engineering plastic, ceramics, glasses, fibers, hard coating layers, especially on microinterconnect flex circuits (1 to 10 mil in total thickness with or without organic cover coating materials) made from polyimide or LCP (Liquid crystal polymers) substrates. A thin conductive film will significantly reduce surface resistivity of the coated surfaces to a range of 10E5 to 10 E9 ohms. The thickness of the film can be adjusted through a cliche design (Pad printing) with a dimensional alignment control at +/- 10-20%, or through mesh design by using screen-printing technique when there is a need in covering small features (200 /spl mu/m). The printing process is a reel-to-reel high volume-manufacturing line. To develop an Reel-To-Reel automatic solder ball (100 to 700,/spl mu/m)jetting process for the thin film microinterconnect flex circuits (1 to 10 mil) in supporting advance flex circuit application for Chip on Flex (COF), Chip On Suspension (COS), Piezo elements (PZT) Attachment, especially on FSA/HGA manufacturing (Flex Suspension Assembly, and Head Gimbal Assembly).
Sponsorship	Chinese Inst. of Electron
Starting Page	230
Ending Page	234
File Size	285498
Page Count	5
File Format	PDF
ISBN	0780381688
DOI	10.1109/EPTC.2003.1298730
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2003-10-28
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Flexible electronics Liquid crystal polymers Polymer films Conducting materials Crystalline materials Conductive films Thin film circuits Organic materials Coatings Printing
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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