NDLI: Fabrication of SiC preform for SiC/Al composite in electronic packaging

Content Provider	IEEE Xplore Digital Library
Author	Qiang Huang Guohua Zhang Rongzheng Ding Daqi Guo Mingyuan Gu
Copyright Year	2003
Description	Author affiliation: Packaging Res. Center, Wuxi Microelectron. Inst., China (Qiang Huang; Guohua Zhang; Rongzheng Ding; Daqi Guo)
Abstract	The relationship between blend ratio (the volume fraction of larger particle size) and rheological properties of concentrated suspensions is of great importance since it is the key to obtain high solid suspensions. The rheological properties of bidisperse aqueous suspensions made of two SiC powders with different particle size (d/sub (0.5)/=1.63 /spl mu/m and 18.43 /spl mu/m, respectively) has been studied as a function of blend ratio. The results showed that the value of critical blend ratio, at which the viscosity is minimized, is in close relation to the shear rate applied. At shear rates below 10 S/sup -1/, the critical /spl xi/ was greater than 70%, but at shear rates from 10 S/sup -1/ to 500 S/sup -1/, /spl xi/ turned out to be 50%. The change of shear region from shear-thinning behavior to shear-thickening behavior may be used to account for the variation of critical /spl xi/. Dynamic oscillatory tests showed that the increment of blend ratio /spl xi/ leads to the change of suspension from nearly an elastic response to a liquid like one. It was also found that the addition of solidum metasilicate increased the strength of the SiC preform and the preform can be demolded without permanent deformation.
Sponsorship	Chinese Inst. of Electron
Starting Page	278
Ending Page	281
File Size	289560
Page Count	4
File Format	PDF
ISBN	0780381688
DOI	10.1109/EPTC.2003.1298740
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2003-10-28
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon carbide Fabrication Preforms Electronics packaging Suspensions Rheology Solids Powders Viscosity Testing
Content Type	Text
Resource Type	Article

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