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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Smith, N. Jun Fan Andresakis, J. Fukawa, Y. Harvey, M. Knighten, J. |
| Copyright Year | 2008 |
| Abstract | Embedding capacitive layers inside the printed circuit board (PCB) have demonstrated the ability to reduce the number of surface mount technology (SMT) chip decoupling capacitors on the PCB surface as well as greatly improve the performance of the power distribution system. Many systems today utilize this technology, but most public information is limited to data on test vehicles or emulators. This paper utilizes simulated as well as measured product data to compare the performance of the standard design to one using various types of embedded capacitor layers with a reduced number of SMT decoupling capacitors. A methodology is provided that can be utilized for other designs. |
| Starting Page | 1919 |
| Ending Page | 1925 |
| File Size | 605640 |
| Page Count | 7 |
| File Format | |
| ISBN | 9781424422302 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2008.4550244 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-05-27 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Capacitors Surface-mount technology Capacitance Resonance Power distribution Predictive models Printed circuits Circuit testing System testing Vehicles |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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