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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Chia-Yan Tan Jenq-Gong Duh |
| Copyright Year | 2008 |
| Description | Author affiliation: Dept. of Mater. Sci. & Eng., Nat. Tsing Hua Univ., Hsinchu (Chia-Yan Tan; Jenq-Gong Duh) |
| Abstract | Nowadays surface mount technology faces a critical problem that is the inelastic strain concentration accumulation in the solder joint during thermal cycling because of the mismatch of thermal expansion coefficient. Recent research has shown that the reinforcement of NiTi shape memory alloy particle in the solder matrix can suppress the inelastic strain concentration. The objective of this research is to investigate how NiTi shape memory alloy applied in the under bump metallurgy can affect solder joint reliability during thermal cycling. Multi layer thin film UBM of Cu/Ni/NiTi was prepared by physical vapor deposition. Photolithography technique and stencil printing was used to form well aligned and homogeneous solder balls on the deposited thin film UBM. The differential scanning calorimetry, transmission electron microscopy and X-ray diffraction were used to identify the crystal structure of NiTi and the crystalline temperature of amorphous NiTi thin film. Moreover, the cross section observation and ball shear test on the solder joint after different thermal cycles revealed the comparison of mechanical properties between samples with and without NiTi thin film. Furthermore, finite element simulation exhibited the influence of NiTi shape memory alloy on plastic strain distribution after thermal cycling. |
| Starting Page | 1300 |
| Ending Page | 1305 |
| File Size | 1287982 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781424422302 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2008.4550143 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-05-27 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Shape memory alloys Metallization Soldering Capacitive sensors Thermal expansion Sputtering Crystallization Plastic films Surface-mount technology Chemical vapor deposition |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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