NDLI: Dispersion and the Worst Case of Thermal Fatigue Life of Solder Joints in Vehicle Electronic Devices

Content Provider	IEEE Xplore Digital Library
Author	Maruoka, T. Qiang Yu Shibutani, T. Miyauci, H.
Copyright Year	2008
Description	Author affiliation: Dept. of Mech. Eng. & Mater. Sci., Yokohama Nat. Univ., Yokohama (Maruoka, T.; Qiang Yu; Shibutani, T.; Miyauci, H.)
Abstract	This paper presents mining the worst case of thermal fatigue life of solder joints on chip components used in vehicle electronics. Typical 36 cases with various solder shapes were examined. Thermal fatigue life including not only the crack initiation but also crack propagation was evaluated by using the finite element method. Based upon the case study's results, it was found that when a crack propagates along the side of the component, the fatigue life of the components will not be affected by the dispersion of the solder joints. However, when the crack propagates into a fillet of solder, the fatigue life will drop greatly, and it will be affected remarkably by the dispersions of the shape of solder joints. Then, based upon the analytical results, it was found that there is a strong interactive relation between the solder joints on two sides of the component, the structural asymmetry was included in the sensitivity analysis processes. It was shown that compared with a standard model (which has a symmetrical structure where fatigue cracks propagate along the side of the component) the worst case has a big unbalance between the values of the two side solder joints. The fatigue cracks change their route from the side of the component to fillet of solder in the smaller side, and the fatigue life of the component shows an 80% decrease. It means that the shape of solder joints should be designed to control the failure mode.
Starting Page	129
Ending Page	132
File Size	2462218
Page Count	4
File Format	PDF
ISBN	9781424421947
ISSN	19308841
DOI	10.1109/IRWS.2008.4796103
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-10-12
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fatigue Soldering Vehicles Environmentally friendly manufacturing techniques Lead Scattering Thermal expansion Capacitive sensors Thermal engineering Shape
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in