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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Kyung-Woon Jang Hyoung-Joon Kim Woon-Seong Kwon Kyung-Wook Paik |
| Copyright Year | 2005 |
| Description | Author affiliation: Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea (Kyung-Woon Jang; Hyoung-Joon Kim; Woon-Seong Kwon; Kyung-Wook Paik) |
| Abstract | In this paper, effects of internal stress on material properties such as CTE, modulus, and glass transition temperature (T/sub g/) of various NCPs and underfill materials for flip chip applications are discussed. And a simple method for the internal stress estimation using material properties is introduced. Usually, internal stresses are generated inside NCPs and underfill materials during a curing process. And these internal stresses affect thermomechanical properties of cured NCPs and underfill materials. Using thermo-mechanical analyzer (TMA), dimensional changes of all materials were measured. Dimensional changes after 1st heating cycle rapidly increased near T/sub g/, however, it was not observed after the 2nd and 3rd heating cycles. This difference between the 1st and 2nd cycles is due to excess free volume built during curing processes. Also, using dynamic mechanical analyzer (DMA), modulus and T/sub g/ were measured. The modulus of the 1st cycle was smaller than that of the 2nd cycle for all materials. Based on these differences in the 1st and 2nd cycles, internal stresses of various materials were theoretically estimated. The estimated stresses build-up of the 1st cycle was different from those of the 2nd cycle for all materials. It is considered that internal stresses generated during a curing process alter the stress state inside materials. |
| Starting Page | 1486 |
| Ending Page | 1490 |
| File Size | 701142 |
| Page Count | 5 |
| File Format | |
| ISBN | 0780389077 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2005.1441983 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2005-05-31 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Internal stresses Conducting materials Flip chip Curing Material properties Thermomechanical processes Heating Glass Temperature Mechanical variables measurement |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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