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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Marjamaki, P. Mattila, T. Kivilahti, J. |
| Copyright Year | 2005 |
| Description | Author affiliation: Lab. of Electron. Production Technol., Helsinki Univ. of Technol., Finland (Marjamaki, P.; Mattila, T.; Kivilahti, J.) |
| Abstract | Lead-free CSP assemblies were drop tested according to the JEDEC standard (JESD-B111) and the finite element analysis of the test assembly was carried out to simulate the strain and stress distributions generated in the assemblies. The vibration of the board during the test was measured with strain gauges and the results were compared to the FE model predictions. The eigenfrequency analysis was executed to determine the mechanical properties of the assemblies under very fast deformations and the results were used to improve the FE model. The calculated strains correspond well with the measured ones and there was good correlation between the calculated stresses and the observed failure modes. |
| Starting Page | 462 |
| Ending Page | 466 |
| File Size | 401771 |
| Page Count | 5 |
| File Format | |
| ISBN | 0780389077 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2005.1441306 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2005-05-31 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Finite element methods Environmentally friendly manufacturing techniques Lead Testing Assembly Strain measurement Stress Vibration measurement Analytical models Capacitive sensors |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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