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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Lall, P. Islam, N. Suhling, J. |
| Copyright Year | 2005 |
| Description | Author affiliation: Dept. of Mech. Eng., Auburn Univ., AL, USA (Lall, P.; Islam, N.; Suhling, J.) |
| Abstract | In this paper, a methodology for prognostication-of-electronics has been developed for accurate assessment of residual life in a deployed electronic components, and determination of damage-state in absence of macro-indicators of failure. Proxies for leading indicators-of-failure have been identified and correlated with damage progression under thermo-mechanical loads. Examples of proxies include microstructural evolution characterized by average phase size and intermetallic growth rate in solder interconnects. Validity of damage proxies has been investigated for both 63Sn37Pb leaded and SnAgCu leadfree electronics. Structures examined include plastic ball grid array format electronic and MEMS packages and discrete devices assembled with FR4-06 laminates. Focus of the research presented in this paper is on interrogation of the aged material's damage state and enhancing the understanding of damage progression. The research is aimed at development of damage relationships for determination of residual life of aged electronics and assessment of design margins instead of life prediction of new components. The prognostic indicators presented in this paper, can be used for health monitoring of electronic assemblies. |
| Starting Page | 1305 |
| Ending Page | 1313 |
| File Size | 1114109 |
| Page Count | 9 |
| File Format | |
| ISBN | 0780389077 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2005.1441437 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2005-05-31 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Environmentally friendly manufacturing techniques Micromechanical devices Electronics packaging Lead Electronic packaging thermal management Assembly Aging Condition monitoring Electronic components Thermomechanical processes |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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