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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Ozdemir, S. Yan Pan Das, A. Memik, G. Loh, G. Choudhary, A. |
| Copyright Year | 2010 |
| Description | Author affiliation: Northwestern University Evanston, IL 60208 (Ozdemir, S.; Yan Pan; Das, A.; Loh, G.; Choudhary, A.) || Georgia Institute of Technology Atlanta, GA 30332 (Memik, G.) |
| Abstract | Variability in device characteristics, i.e., parametric variations, is an important problem for shrinking process technologies. They manifest themselves as variations in performance, power consumption, and reduction in reliability in the manufactured chips as well as low yield levels. Their implications on performance and yield are particularly profound on 3D architectures: a defect on even a single layer can render the entire stack useless. In this paper, we show that instead of causing increased yield losses, we can actually exploit 3D technology to reduce yield losses by intelligently devising the architectures. We take advantage of the layer-to-layer variations to reduce yield losses by splitting critical components among multiple layers. Our results indicate that our proposed method achieves a 30.6% lower yield loss rate compared to the same pipeline implemented on a 2D architecture. |
| Starting Page | 144 |
| Ending Page | 149 |
| File Size | 353820 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781424466771 |
| ISSN | 0738100X |
| e-ISBN | 9781450300025 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-06-13 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Association for Computing Machinery, Inc. (ACM) |
| Subject Keyword | Microarchitecture Integrated circuit interconnections Stacking Manufacturing Energy consumption Integrated circuit technology Delay Bonding Integrated circuit reliability Pipelines 3D Integration Process Variations Processor Pipeline Cache Architectures |
| Content Type | Text |
| Resource Type | Article |
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