NDLI: Aerosol deposition for ceramic thick film formation at room temperature

Content Provider	IEEE Xplore Digital Library
Author	Tsurumi, T. Ma, J. Li, J. Kakemoto, H. Tsukiori, D. Sakamaki, R. Wada, S. Akedo, J.
Copyright Year	2007
Description	Author affiliation: Tokyo Inst. of Technol., Tokyo (Tsurumi, T.; Ma, J.; Li, J.; Kakemoto, H.; Tsukiori, D.; Sakamaki, R.)
Abstract	Fabrication of ceramic thick films on Cu or other metal substrates is a key issue to realize the integration and the embedding of passive components in print wiring boards (PWB). The aerosol deposition (AD) process developed in AIST, Japan is the only technique to fabricate ceramics thick films at room temperature. Barium titanate films were successfully deposited on Cu substrate at room temperature for embedded capacitors. Dielectric permittivity of the film was less than 200 because particles of barium titanate were broken into small peaces in the deposition process. A heat treatment at 300degC improved the permittivity up to 240, giving rise to the capacitance density above 3 $nF/mm^{2}.$ Microwave dielectric films of $Ba_{4.2}Sm_{9.2}Til_{8}O_{54}$ were deposited on Cu substrate. A transparent film shows almost the same permittivity and $TC_{f}$ with bulk ceramics. $Al_{2}O_{3}$ films were deposited on Al for the application to high-power module substrates. This $AI_{2}O_{3}/AI$ substrates showed better durability in a heat-cycle test than conventional AIN/Al substrates used in high-power electronic circuits of hybrid-cars.
Starting Page	464
Ending Page	465
File Size	2490000
Page Count	2
File Format	PDF
ISBN	9781424413331
ISSN	10994734
DOI	10.1109/ISAF.2007.4393299
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-05-27
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Aerosols Ceramics Thick films Temperature Barium Dielectric substrates Permittivity Titanium compounds Artificial intelligence Circuit testing
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in