NDLI: The effect of heat treatment on flexibility of silver nanopaste circuit screen-printed on polyimide

Content Provider	IEEE Xplore Digital Library
Author	Kwang-Seok Kim Young-Chul Lee Jee-Hyuk Ahn Seung-Boo Jung
Copyright Year	2010
Description	Author affiliation: School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon 440-746, Republic of Korea (Kwang-Seok Kim; Young-Chul Lee; Jee-Hyuk Ahn; Seung-Boo Jung)
Abstract	We evaluated the flexibility of screen-printed silver (Ag) circuits under various sintering temperatures. The circuits were built on a polyimide (PI) film by a screen printing technique using Ag nanopaste (73 wt%, 24 nm in diameter, Ag nanoparticles). The sintering temperature was raised from 150 to 300 °C while the sintering time was fixed at 30 min. The flexibility was measured by two different kinds of methods; Massachussets Institute of Technology (MIT) type folding endurance test, and Institute for Interconnecting and Packaging Electronic Circuits (IPC) flexural resistance endurance test. In order to measure the flexibility of Ag circuits under various sintering temperatures, the changes of electrical resistance were observed while the printed Ag circuits were being folded or slid. The circuits sintered at higher temperatures needed more sliding and folding cycles to reach the critical point: while the sintering temperature increased from 150 °C to 300 °C, the flexibility decreased by around 90 % and 75 % after the IPC sliding process, and MIT folding process, respectively. The results showed that the flexibility of printed circuits was affected by the microstructural changes depending on the sintering temperature.
Starting Page	306
Ending Page	309
File Size	510447
Page Count	4
File Format	PDF
ISBN	9781424488964
e-ISBN	9781424488971
DOI	10.1109/NMDC.2010.5652445
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-10-12
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Resistance Printing Temperature measurement Nanoparticles MIT folding endurance test Ag nanopaste Films Printed circuits IPC flexural resistance endurance test Sintering temperature Flexibility Substrates
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in