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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Yee-Wen Yen Hsien-Ming Hsiao Gu-Jhong Jhang Han-Wei Shi Meng-Kuang Huang |
| Copyright Year | 2012 |
| Description | Author affiliation: Department of Chemical Engineering and Biotechnology, National Taipei University of Technology, Taipei, 10608, Taiwan, R.O.C. (Han-Wei Shi; Meng-Kuang Huang) || Department of Materials Science and Engineering, National Taiwan University of Science and Technology, 106 Taipei, Taiwan, R.O.C. (Yee-Wen Yen; Hsien-Ming Hsiao; Gu-Jhong Jhang) |
| Abstract | The Sn-Bi solder is a very common lead-free solder used in electronic packaging due to its low eutectic temperature (138°C). Copper is generally used as the substrate in a printed circuit board (PBC) and a metallic pad in the integrated circuit (IC) fabrication. Cu is also used as the under-bump metallurgy (UBM) of the flip chip (FC) package. Thus, for reliability of a solder-joint, it is necessary to make a clear understanding of the phase equilibria in the the Sn-Bi-Cu ternary system. In this study, the isothermal sections of the Sn-Bi-Cu ternary system were experimentally established at 400 and 120°C. The experimental results indicated that no ternary intermetallic compounds were found at both 400 and 120°C in Sn-Bi-Cu ternary system. The isothermal sections of the Sn-Bi-Cu ternary system at 400 and 120°C consist of five single-phase areas, seven two-phase areas, and three tie-triangles, respectively. The Cu3Sn phase is in equilibrium with most stable single phases in these two isothermal sections. This phase should be the most stable phase in the Sn-Bi-Cu ternary system. |
| Starting Page | 388 |
| Ending Page | 391 |
| File Size | 1157546 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781467316354 |
| ISSN | 21505934 |
| e-ISBN | 9781467316385 |
| e-ISBN | 9781467316378 |
| DOI | 10.1109/IMPACT.2012.6420287 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-10-24 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | X-ray scattering Annealing Sn-Bi-Cu ternary system Isothermal section phase equilibria Bismuth Tin Educational institutions Isothermal processes lead-free solder |
| Content Type | Text |
| Resource Type | Article |
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