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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Yee-wen Yen Meng-Han Kuo Wei-Kai Liou Tai-Ni Chu |
| Copyright Year | 2012 |
| Description | Author affiliation: Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei 106, Taiwan, ROC (Yee-wen Yen; Meng-Han Kuo; Wei-Kai Liou; Tai-Ni Chu) |
| Abstract | This study investigates the dissolution behavior of metallic substrates-Ni and IMC-Ni3Sn4 phase in molten Sn, SAC, SC, SB and SZ at 240, 270, and 300°C. The dissolution rates of the Ni substrate in molten solder follow the order Sn > SAC > SC > SB > SZ. Many the Ni3Sn4 phases with a small grain size were formed at the Sn/Ni system. Because a small grain could provide more groove to let Ni atoms dissolve in the molten Sn, the largest dissolution rate is in the Sn/Ni system. The dense Ni5(Zn, Sn)21 phase was formed in the SZ/Ni system. This dense layer inhibited the Ni atoms to dissolve into the molten solder. Thus, the SZ/Ni system has the lowest dissolution rate. The dissolution rate of the Ni3Sn4 substrate in molten solders follows the order Sn > SAC > SC > SB at 240°C and Sn > SC > SAC > SB at 300°C. There is no any IMC found in the Sn/Ni3Sn4 and SB/Ni systems. The (Cu, Ni)6Sn5 was observed in the SAC/Ni3Sn4 and SC/Ni3Sn4 systems. In the SZ/Ni3Sn4 system, the Ni5(Zn,Sn)21 phase was formed at the interface. Meanwhile, the Zn atoms diffused toward the Ni3Sn4 substrate to incorporate the sublattice of the Ni3Sn4 phase. Finally, the Ni3(Sn,Zn)4 layer was observed below the Ni5(Zn,Sn)21 phase. |
| Starting Page | 392 |
| Ending Page | 395 |
| File Size | 2195981 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781467316354 |
| ISSN | 21505934 |
| e-ISBN | 9781467316385 |
| e-ISBN | 9781467316378 |
| DOI | 10.1109/IMPACT.2012.6420288 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-10-24 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Tin Aging Lead Nickel Substrates Zinc |
| Content Type | Text |
| Resource Type | Article |
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