NDLI: Thermal fatigue damage of quad flat pack leads and Sn-3.5Ag-X (X=Bi and Cu) solder joints

Content Provider	IEEE Xplore Digital Library
Author	Warashina, K. Kariya, Y. Hirata, Y. Otsuka, M.
Copyright Year	1999
Description	Author affiliation: Dept. of Mater. Sci. & Technol., Shibaura Inst. of Technol., Tokyo, Japan (Warashina, K.)
Abstract	Quad flat pack (QFP) leads/Sn-3.5Ag-X (X=Bi and Cu) joint was thermally cycled between 243 K and 403 K or 273 K and 373 K, and relationship between thermal fatigue of QFP solder joint and isothermal fatigue properties of bulk solder has been discussed. Both metallographic examination and mechanical pull test were preformed to evaluate thermal fatigue damage of the joint. The addition of bismuth drastically degrades the thermal fatigue resistance of Sn-3.5Ag solder. On the other hand the pull strength of Sn-3.5Ag-Cu solder joints slightly decreased with increasing number of thermal cycles, though it still remains higher in comparison to that for conventional Sn-37Pb or bismuth containing solder joints. The behavior observed here reflects the isothermal fatigue properties of bulk solder because thermal fatigue crack initiates at the surface of the solder fillet and propagates within the fillet in an early stage of fatigue damage.
Starting Page	626
Ending Page	631
File Size	287803
Page Count	6
File Format	PDF
ISBN	0769500072
DOI	10.1109/ECODIM.1999.747688
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-02-01
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fatigue Electronics packaging Soldering Lead Isothermal processes Bismuth Thermal resistance Testing Thermal degradation Surface cracks
Content Type	Text
Resource Type	Article

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