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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Hsiang-Chen Hsu Jih-Hsin Chien Li-Ming Chu Shin-Pon Ju Yu-Ting Feng Shen-Li Fu |
| Copyright Year | 2012 |
| Description | Author affiliation: Department of Mechanic and Automation Engineering, I-Shou University, No.1, Sec.1, Syuecheng Rd., Dashu District, Kaohsiung, Taiwan 84001, R.O.C. (Hsiang-Chen Hsu; Jih-Hsin Chien; Li-Ming Chu) || Department of Electronic Engineering, I-Shou University, No.1, Sec.1, Syuecheng Rd., Dashu District, Kaohsiung, Taiwan 84001, R.O.C. (Shen-Li Fu) || Department of Mechanical & Electro-Mechanical Engineering, National Sun Yat-Sen University, No. 70, Lienhai Rd., Kaohsiung, Taiwan 80424, R.O.C. (Shin-Pon Ju; Yu-Ting Feng) |
| Abstract | In this paper, the growth mechanism of intermetallic compound (IMC) layer between Copper (Cu) free air ball (FAB) and Aluminum (Al) bond pad is carefully examined. The test vehicle is pd-coated Cu wirebonds on Al pad in plastic ball grid array (PBGA) package. Palladium (Pd), the anti-oxide material coated on Cu wire will be blended in the Cu FAB when the ball is formed by an electrical flame-off (EFO). Preliminary results demonstrated that IMC cracks from the edge of bonding interface and spreads into the center area. This is the cause of open fail. The IMC between Cu and Al was initially generated in the form of CuAl2, and gradually increased the content of Cu and turned into CuAl when the working temperature was increased. The final stage of IMC growth is Cu9Al4 and the aluminum pad will be vanished as the result of Cu diffusivity. Bondability on nanoscale IMC of CuAl2, CuAl and Cu9Al4 are also cautiously investigated by using molecular dynamics (MD) simulations. Atomic-level tensile stress and tensile strain are predicted to examine the bonding strength of two IMCs along the bonding interface. Interfacial fracture is different in different tensile speed as well as the working temperature. A series of experimental works and MD simulations are conducted in this research. |
| Starting Page | 64 |
| Ending Page | 67 |
| File Size | 817269 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781467316354 |
| ISSN | 21505934 |
| e-ISBN | 9781467316385 |
| e-ISBN | 9781467316378 |
| DOI | 10.1109/IMPACT.2012.6420255 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-10-24 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | bonding interface bondability molecular dynamics (MD) Materials nanoscale IMC Predictive models Nanoscale devices Copper Mathematical model Bonding Stress |
| Content Type | Text |
| Resource Type | Article |
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