NDLI: Intermetallic Compound Formation and Diffusion Path Evolution in the Flip Chip Sn-37Pb Solder Bump after Aging

Content Provider	IEEE Xplore Digital Library
Author	Li-Yin Hsiao Jenq-Gong Duh
Copyright Year	2005
Description	Author affiliation: Dept. of Mater. Sci. & Eng., National Tsing Hua Univ., Hsinchu (Li-Yin Hsiao; Jenq-Gong Duh)
Abstract	In the flip-chip technology of current microelectronic package, Ni-based under-bump metallurgy (UBM) is widely used due to its slower reaction rate with Sn. In this study, solders joints of eutectic Pb-Sn/Ni-UBM were employed to investigate the intermetallic compound (IMC) formation after aging at 150 degC for various periods of time. The compositions and elemental re-distribution in the IMC formed due to the interfacial reaction between the Ni/Cu UBM and eutectic Sn-Pb solders were deliberately evaluated with an electron probe microanalyzer. The interfacial morphologies were revealed with the aid of a field-emission scanning electron microscope through special etching technique. In the center of the chip side, two IMCs were found between solders and Ni metallization. The scalloped-type IMC was (Cu,Ni)6 $}Sn_{5},$ while nodular-type IMC was $(Ni,Cu)_{3}Sn$ $_{4}.$ However, in the edge of the chip side, three IMCs were revealed. The scalloped-type IMC was $(Cu_{1-y},Ni_{y})$ $_{6}Sn_{5},$ nodular-type IMC was $(Ni_{1-x,}Cu$ $_{x})_{3}Sn_{4},$ and layer-type IMC was $(Cu_{1-z},Ni_{z})_{3}Sn.$ On the basis of elemental distribution in the quantitative analysis for the IMC and the related phase transition among the intermetallic compound formation, two distinct diffusion paths were proposed to illustrate the interfacial reaction and phase transformation between IMCs and solder in the Sn-Pb joints aged at 150 degC. These diffusion paths demonstrated two kinds of phase equilibrium, including $(Cu_{1-z},Ni_{z})_{3$ $}Sn/(Cu_{1$ - $y},Ni_{y})_{6}Sn_{5}/solder$ and (Ni1-x $},Cu_{x})_{3}Sn_{4}/(Cu_{1-y}Ni$ $_{y})_{6}Sn_{5}/solder$
Starting Page	1
Ending Page	8
File Size	8369402
Page Count	8
File Format	PDF
ISBN	0780392922
DOI	10.1109/HDP.2005.251393
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-06-27
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Intermetallic Flip chip Aging Tin Electrons Microelectronics Packaging Soldering Probes Morphology
Content Type	Text
Resource Type	Article

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