NDLI: Macro-Micro Modeling Analysis for High Density Packaged Flip Chips

Content Provider	IEEE Xplore Digital Library
Author	Yin, C.Y. Lu, H. Bailey, C. Chan, Y.C.
Copyright Year	2005
Description	Author affiliation: Sch. of Comput. & Math. Sci., Greenwich Univ., London (Yin, C.Y.; Lu, H.; Bailey, C.)
Abstract	A wide range of flip chip technologies with solder or adhesives have become dominant solutions for high density packaging applications due to the excellent electrical performance, high I/O density and good thermal performance. This paper discusses the use of modeling technique to predict the reliability of high density packaged flip chips in the humid environment. Reliability assessment is discussed for flip chip package at ultra-fine pitch with anisotropic conductive film (ACF). The purpose of this modeling work is to understand the role that moisture plays in the failure of ACF flip chips. A macro-micro 3D finite element modeling technique was used in order to make the multi-length-scale modeling of the ACF flip chip possible. Modeling results are consistent with the findings in the experimental work
Starting Page	1
Ending Page	4
File Size	360969
Page Count	4
File Format	PDF
ISBN	0780392922
DOI	10.1109/HDP.2005.251383
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-06-27
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Flip chip Moisture Assembly Capacitive sensors Temperature Gold Thermal stresses Electronics packaging Electronic packaging thermal management Predictive models
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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