NDLI: Underwater Robot Vertical Manipulator Control

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2007 International Symposium on High Density packaging and Microsystem Integration

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.

2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis

Digital Memory Card Market and Technology

Experiments on the Bonding Interface Vibration of Thermosonic Flip Chip

Post-bond Compression Process for Bonding Thin-Die on BT Substrate using Thermoplastic Adhesive Tape

Study of Ultrasonic Power Parameter on the Large Aluminum Wire Wedge Bonding Strength

Reliability Study for Test Lands Targeting during Electrical Testing

Switch Design and Implementation for Network-on-Chip

Mechanism Analysis of Process Parameters Effects on Bondability in Ultrasonic Ball Bonding

Key Learning from Quanta ICT Low resistance Failure Issue

The 2004 International Electronics Manufacturing Initiative (iNEMI) Technology Roadmaps

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Sub-100 micron pitch stencil printing for wafer scale bumping

BGA 44um Fine Pitch Low K Wire Bonding Process Development

Mechanics of Interfacial Delamination in IC Packages Undergoing Solder Reflow

Study on the fatigue life of the FC-BGA solder joints with Damage

Elemental Redistribution and Diffusion Path Configuration Near the Edge of Sn-95Pb Solder Bump/Ni-Cu UBM Joints after Aging in the Flip-Chip Technology

Macro-Micro Modeling Analysis for High Density Packaged Flip Chips

Adhesion Study of Copper Layer Deposited onto Liquid Crystalline Polymer for Electronic Packaging

Interface Modelling of ACA Interconnects Using Micropolar Theory

An Ontology for Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications

Effect of curing conditions on the interconnect properties of isotropic conductive adhesives composed of an epoxy-based binder

Fundamental Research of No-Flow UF for Low Stress Flip-Chip Package

Residual Stress in Flip Chip Joining Using Anisotropic Conductive Adhesive

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The Evaluation of Sn-58Bi Composite Solder Mixed with Y2O3

High Strain Rate Testing of Solder Interconnections

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Wetting Dynamics Study of Sn-Ag Solder during Reflow

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Underwater Robot Vertical Manipulator Control

Modeling Analysis and Designing the Flight Control System on A Sub-Mini Unmanned Helicopter Robot

Switch Design and Implementation for Network-on-Chip

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The Study Of Improved RWPA For The Multiple-Core Chip

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04)

Underwater Robot Vertical Manipulator Control

Content Provider	IEEE Xplore Digital Library
Author	Zhai Yuyi Chen Weihua Tang Haibing Gong Zhengbang
Copyright Year	2005
Description	Author affiliation: Sch. of Mechatron. Eng. & Autom., Shanghai Univ. (Zhai Yuyi; Chen Weihua; Tang Haibing; Gong Zhengbang)
Abstract	The authors designed an underwater robot based on spatial mathematical models. The paper deduces the concerning simulation models and simplifies them. Calibrate the system by digital PID controller after analyzing the state of holistic performance. Besides, analyze setting methods of PID parameters and the impacts on system performance in detail. Finally, simulate the system by Simulink models furnished by Matlab6.5 and attain the simulation results with referenced values
Starting Page	1
Ending Page	5
File Size	100983
Page Count	5
File Format	PDF
ISBN	0780392922
DOI	10.1109/HDP.2005.251436
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-06-27
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Manipulators Robot control Mathematical model Performance analysis Three-term control Digital control Control systems Control system analysis System performance Computer languages controller Underwater robot Simulation model Manipulator control
Content Type	Text
Resource Type	Article

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