NDLI: Experimental Research on Heat Transfer of Confined Air Jet Impingement with Tiny Size Round Nozzle in High Density Electronics Packaging Model

Content Provider	IEEE Xplore Digital Library
Author	Tu Juan Zhou Jie-min Jiang Li Yang Ying
Copyright Year	2005
Description	Author affiliation: Sch. of Energy & Power Eng., Central South Univ., Changsha (Tu Juan; Zhou Jie-min; Jiang Li; Yang Ying)
Abstract	As the heat generation density of electronics packaging grow fast during recent years, the problem of heat dissipation of electronics become the obstruction of development of electronic packaging industry, which accelerated the research and development of heat transfer on the direction of microcosmic. In this research, an epoxy resin laminate heated by heating element was used as the heat transfer surface of simulated chip, and the thermocouples were mounted symmetrically along the diagonal of the laminate to measure the temperature distribution of the surface. Air jet, driven by a small pump, comes from round nozzles (1.5mm and 1mm in diameter) and impinges on the heat transfer surface with middle and low Reynolds number. The parameters such as Reynolds number and height-to-diameter ratio was changed to investigate the radial distribution of Nusselt number and the characteristics of heat transfer in stagnant section. This experimental research gives useful information for the application of air jet impingement to the cooling of electronics packaging
Starting Page	1
Ending Page	6
File Size	106849
Page Count	6
File Format	PDF
ISBN	0780392922
DOI	10.1109/HDP.2005.251419
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-06-27
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Heat transfer Electronics packaging Laminates Industrial electronics Electronics industry Acceleration Research and development Epoxy resins Semiconductor device measurement Temperature measurement electronics packaging air jet impingement simulated chip
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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