NDLI: Molecular simulation of cu-sam adhesion force

Content Provider	IEEE Xplore Digital Library
Author	Haibo Fan Wong, C.K.Y. Yuen, M.M.F.
Copyright Year	2004
Description	Author affiliation: Hong Kong University of Science and Technology (Haibo Fan)
Abstract	The interface of Copper-EMC (Epoxy Molding Compound) is known to be the weakest joint in the electronic package design, which causes delamination during reliability test. A prime reason is the poor adhesion between Cu and epoxy compound. To solve the problem, We have used self-assembly monolayer (SAM) to improve adhesion of copper-epoxy system. This paper focuses on simulation of adhesion in Cu-SAM system. In this study, molecular models of bi-material system, which consists of SAM and Cu, were built to evaluate adhesion force of the Cu-SAM system. In order to dramatically reduce the computational time, only the copper tip and SAM substrate were modeled with a limited number of atoms. After energy minimization of the whole structure, tensile stresses were applied to the whole structure to simulate the debonding process, and the ultimate stress was obtained when the two materials delaminates completely. The adhesion force between the copper tip and the SAM can be evaluated from the ultimate tensile stress. The molecular model results were compared with AFM results in which adhesion force between Cu tip and SAM coated copper substrate were measured. Two different types of SAM material were used in this study. The paper intended to relate closely adhesion by using MD simulation, and the underlying physics for the explanation to the adhesion phenomenon for further understanding of failure mechanism of interfacial delamination.
Sponsorship	IEEE-CPMT
Starting Page	575
Ending Page	579
File Size	709893
Page Count	5
File Format	PDF
ISBN	0780384202
DOI	10.1109/ESIME.2004.1304094
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-05-10
Publisher Place	Belgium
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Adhesives Atomic force microscopy Copper Rough surfaces Surface roughness Tensile stress Delamination Electronics packaging Self-assembly Computational modeling
Content Type	Text
Resource Type	Article

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