NDLI: A review of creep fatigue failure models in solder material - simplified use of a continuous damage mechanical approach

Content Provider	IEEE Xplore Digital Library
Author	Massiot, G. Munier, C.
Copyright Year	2004
Description	Author affiliation: EADS Corporate Res. Center, Suresnes, France (Massiot, G.; Munier, C.)
Abstract	Numerical methods have become a useful mean to predict the thermo-mechanical reliability of solder interconnects in electronics, at least comparatively. In principle, each calculation finally rests on a creep fatigue model or criterion. The article reviews some important failure models of solder found in literature, discusses their benefits and drawbacks, and finally compares them on the example of a semi-analytical assembly model. Cyclic fatigue criteria constitute the classical approach in creep fatigue modelling. Strain range, strain range partitioning, inelastic energy and energy partitioning, are all approaches which have lead to successful development of failure models for solder in electronics. Beside cyclic criteria, continuous damage mechanical models have been developed recently in different publications. They are basically extended sets of constitutive equations including a new variable called damage. In such approaches, damage may be integrated over any cyclic or non-cyclic solicitation. A semi-analytical model of a flip chip PBGA (plastic ball grid array) assembly has been developed in order to implement a continuous damage mechanical approach. Then it is used for comparisons with some cyclic fatigue criteria on the same thermal cycle. The assembly model is based on the theory of bi-material thermostats and on a continuous damage mechanical model found in a recent publication. Only the outline of the model is described. Easy parametrisation and short calculation delays allow to run the model over high number of thermal cycles and to study the damage evolution. Results have not been correlated with experimental data, but are in a correct order of magnitude, whatever failure criterion is applied.
Sponsorship	IEEE-CPMT
Starting Page	465
Ending Page	472
File Size	774779
Page Count	8
File Format	PDF
ISBN	0780384202
DOI	10.1109/ESIME.2004.1304079
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-05-10
Publisher Place	Belgium
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Creep Fatigue Assembly Capacitive sensors Thermomechanical processes Lead Equations Flip chip Plastics Electronics packaging
Content Type	Text
Resource Type	Article

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