NDLI: Compact electro-thermal models of semiconductor devices with multiple heat sources

Content Provider	IEEE Xplore Digital Library
Author	Bohm, C. Hauck, T. Rudnyi, E.B. Korvink, J.G.
Copyright Year	2004
Description	Author affiliation: Motorola GmbH, Munchen, Germany (Bohm, C.; Hauck, T.; Rudnyi, E.B.; Korvink, J.G.)
Abstract	The thermal management of semiconductor devices and systems becomes crucial as the power consumed by chips is increasing. For manufacturers it is important to enable the customer to simulate the thermal performance of semiconductor packages at different ambient conditions and arbitrary transient loading conditions. As simulation speed in this case is crucial, compact thermal models are of great importance. In the present work, a new approach to generate compact thermal models of semiconductor packages on PCBs is presented. The main difference from conventional RC-like thermal networks is that the compact model is obtained through a formal model reduction procedure. Model reduction starts with an accurate high-dimensional thermal model created with a finite element program like ANSYS. A low-dimensional model is obtained in such a way that the first moments of the transfer function are the same as in the original model. A model of a semiconductor device with multiple heat sources is used in order to compare this method with a thermal RC network approach. Temperature response results to user defined loading conditions are also compared.
Sponsorship	IEEE-CPMT
Starting Page	101
Ending Page	104
File Size	546400
Page Count	4
File Format	PDF
ISBN	0780384202
DOI	10.1109/ESIME.2004.1304028
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-05-10
Publisher Place	Belgium
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Semiconductor devices Power system modeling Thermal management Semiconductor device packaging Reduced order systems Energy management Power system management Virtual manufacturing Semiconductor device manufacture Thermal loading
Content Type	Text
Resource Type	Article

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