NDLI: Thermal analysis of QFN packages using finite element method

Content Provider	IEEE Xplore Digital Library
Author	Chia-Lung Chang Yow-Yi Hsieh
Copyright Year	2004
Description	Author affiliation: Mech. Eng. Dept., Nat. Yunlin Univ. of Sci. & Technol., Taiwan (Chia-Lung Chang; Yow-Yi Hsieh)
Abstract	The QFN (quad flat non-leaded) package is a new type of chip scale package. In this study, both the FEM solid model and CFD model of QFN package were generated to predict the junction-to-ambient thermal resistance of the package under natural and forced convection. The solid model uses flat plate surface convection correlations to simulate the package and board cooling. The CFD model uses computational fluid dynamics software to simulate surface convective loads. In comparison with experimental measurements, the results show that the CFD model is more accurate than the solid model to predict the thermal resistance of the package. The convection heat transfer coefficients obtained from CFD model were also applied to the surface correlations of FEM solid model. It shows that the accuracy of simulation results by FEM solid model can be improved with the surface convection correlations of CFD results. Furthermore, the distribution of heat transfer over external faces of the package is calculated. The results show that most of the heat is dissipated to the board through the bottom surface of the lead frame.
Sponsorship	IEEE-CPMT
Starting Page	499
Ending Page	503
File Size	491718
Page Count	5
File Format	PDF
ISBN	0780384202
DOI	10.1109/ESIME.2004.1304083
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-05-10
Publisher Place	Belgium
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Finite element methods Solid modeling Computational fluid dynamics Predictive models Thermal resistance Surface resistance Computational modeling Chip scale packaging Heat transfer Thermal force
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in