NDLI: Crack and delamination risk evaluation of thin silicon applications based on fracture mechanics approaches

Content Provider	IEEE Xplore Digital Library
Author	Auersperg, J. Vogel, D. Michel, B.
Copyright Year	2004
Description	Author affiliation: Dept. Mech. Reliability & Micro Mater., Fraunhofer Inst. for Reliability & Microintegration Berlin, Germany (Auersperg, J.; Vogel, D.; Michel, B.)
Abstract	Enhanced miniaturization and system integration of microelectronics components demands growth in novel solutions toward embedding active and passive components into substrates, clothes, protective sleeves of consumer goods - smart, thin applications in general. As a result, the embedding of very thin silicon dies and metallic structures into highly flexible polymeric, paper like or textile materials causes several mechanical problems preventing those applications from being utilized. This paper intends to demonstrate and discuss advantages and needs of using fully parameterized finite element modeling techniques for design optimizations of thin devices on the basis of damage evaluation and fracture mechanics approaches. For improving that method, the evaluation of mixed mode interface delamination phenomena and fracture of embedded thin silicon were combined with experimental investigations.
Sponsorship	IEEE-CPMT
Starting Page	169
Ending Page	174
File Size	1184190
Page Count	6
File Format	PDF
ISBN	0780384202
DOI	10.1109/ESIME.2004.1304037
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-05-10
Publisher Place	Belgium
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Delamination Silicon Microelectronics Electronic packaging thermal management Thermal stresses Protection Polymers Textiles Inorganic materials Finite element methods
Content Type	Text
Resource Type	Article

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