NDLI: A computer-architecture approach to thermal management in computer systems: opportunities and challenges

Content Provider	IEEE Xplore Digital Library
Author	Skadron, K. Stan, M.R. Wei Huang Sankaranarayanan, K. Zhijian Lu Lach, J.
Copyright Year	2004
Description	Author affiliation: Dept. of Comput. Sci., Virginia Univ., Charlottesville, VA, USA (Skadron, K.)
Abstract	Cooling costs for notebook, desktop, and server computer systems are rising exponentially as power densities for high-performance chips continue to double every three years. Research has led to a range of advances in modeling and design of thermal packaging and circuit boards. Yet a major front that has been absent is thermal design in the computer architecture domain, where processor utilization, the interleaving of different computation processes, and the flow of instructions through the CPU are controlled. The architecture domain presents a rich opportunity for thermal management that complements other advances by controlling temperature at runtime in response to the dynamic behavior of the computer's current workload. This paper describes a compact modeling algorithm that is appropriate for this domain, presents some architecture techniques for runtime thermal management, and describes some interesting problems that remain to be solved.
Sponsorship	IEEE-CPMT
Starting Page	415
Ending Page	422
File Size	957094
Page Count	8
File Format	PDF
ISBN	0780384202
DOI	10.1109/ESIME.2004.1304072
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-05-10
Publisher Place	Belgium
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal management Computer architecture Runtime Power system management Cooling Costs Power system modeling Packaging Printed circuits Interleaved codes
Content Type	Text
Resource Type	Article

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