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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Lloyd, J.R. Liu, X-.H. Bonilla, G. Shaw, T.M. Liniger, E. Lisi, A. |
| Copyright Year | 2009 |
| Description | Author affiliation: IBM TJ Watson Research Center, Yorktown Heights NY 10598, USA (Lloyd, J.R.; Liu, X-.H.; Bonilla, G.; Shaw, T.M.; Liniger, E.) || IBM Microelectronics, East Fishkill Facility, Hopewell Jct. NY, USA (Lisi, A.) |
| Abstract | A TDDB reliability experiment was performed on interdigitated comb structures with intentionally severe line-edge roughness and the results were then compared to a simple theoretical model. It is seen that for the case studied, the predictions of the model do not compare well to the experimental data, but that for some observed cases the effect of reducing spacing between lines is so strong that more substantial defects must be invoked as a source of failure. |
| Starting Page | 602 |
| Ending Page | 605 |
| File Size | 736741 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424428885 |
| ISSN | 15417026 |
| DOI | 10.1109/IRPS.2009.5173317 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-04-26 |
| Publisher Place | Canada |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Dielectrics Capacitors Voltage Space technology Microelectronics Reliability theory Predictive models Testing Integrated circuit reliability Integrated circuit technology Low-k dielectrics TDDB LER |
| Content Type | Text |
| Resource Type | Article |
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