NDLI: Design considerations for attachment and detachment in robot climbing with hot melt adhesives

Content Provider	IEEE Xplore Digital Library
Author	Liyu Wang Neuschaefer, F. Bernet, R. Iida, F.
Copyright Year	2012
Description	Author affiliation: Bio-Inspired Robotics Laboratory, Department of Mechanical and Process Engineering, ETH Zurich, 8092, Switzerland (Liyu Wang; Neuschaefer, F.; Bernet, R.; Iida, F.)
Abstract	Robust climbing in unstructured environments is a long-standing challenge in robotics research. Recently there has been an increasing interest in using adhesive materials for that purpose. For example, a climbing robot using hot melt adhesives (HMAs) has demonstrated advantages in high attachment strength, reasonable operation costs, and applicability to different surfaces. Despite the advantages, there still remain several problems related to the attachment and detachment operations, which prevent this approach from being used in a broader range of applications. Among others, one of the main problems lies in the fact that the adhesive characteristics of this material were not fully understood fin the context of robotic climbing locomotion. As a result, the previous robot often could not achieve expected locomotion performances and “contaminated” the environment with HMAs left behind. In order to improve the locomotion performances, this paper focuses on attachment and detachment operations in robot climbing with HMAs. By systematically analyzing the adhesive property and bonding strength of HMAs to different materials, we propose a novel detachment mechanism that substantially improves climbing performances without HMA traces.
Starting Page	1181
Ending Page	1186
File Size	1156217
Page Count	6
File Format	PDF
ISBN	9781467314039
ISSN	10504729
e-ISBN	9781467314053
e-ISBN	9781467314046
DOI	10.1109/ICRA.2012.6224955
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-05-14
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Foot Materials Bonding forces Heating Climbing robots
Content Type	Text
Resource Type	Article
Subject	Artificial Intelligence Control and Systems Engineering Electrical and Electronic Engineering Software

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