NDLI: Millimeter-scale microrobots for wafer-level factories

Content Provider	IEEE Xplore Digital Library
Author	Murthy, R. Popa, D.O.
Copyright Year	2010
Description	Author affiliation: Automation & Robotics Research Institute, The University of Texas at Arlington, USA (Murthy, R.; Popa, D.O.)
Abstract	Current top down manipulation systems used in micro and nanomanufacturing are many orders of magnitude larger than the parts being handled, leading to difficult tradeoffs between their precision, throughput and cost. This paper presents recent research progress in the manufacturing of millimeter sized robotic positioning technology that allows combining high precision with high throughput along with other application-specific requirements such as strength, dexterity, and work volume. The first robot type is the ARRIpede microcrawler, and we describe recent progress in microrobot packaging and backpack electronics leading to its untethered operation. Precision measurements describing the ARRIpede motion resolution and repeatability are reported. The second microrobot called the Articulated Four Axes Microrobot (AFAM) is a 3D dexterous micromanipulator robot, and we describe nanoindentation experiments using SPM tips mounted on the microrobot. By combining positioning data obtained using laser interferometers and SEM imaging of nanoindentation data, precision metrics such as accuracy, repeatability and resolution of the AFAM robot are determined. Using these two microrobots as basic positioning and manipulation units, we propose a concept for a nanoassembly module, or a so-called wafer-level factory.
Starting Page	488
Ending Page	493
File Size	743909
Page Count	6
File Format	PDF
ISBN	9781424450381
ISSN	10504729
DOI	10.1109/ROBOT.2010.5509795
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-05-03
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Production facilities Robots Throughput Costs Pulp manufacturing Electronics packaging Motion measurement Micromanipulators Scanning probe microscopy Interferometers
Content Type	Text
Resource Type	Article
Subject	Artificial Intelligence Control and Systems Engineering Electrical and Electronic Engineering Software

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