NDLI: Microelectrodes with three-dimensional structures for improved neural interfacing

Content Provider	IEEE Xplore Digital Library
Author	Metz, S. Heuschkel, M.O. Valencia Avila, B. Holzer, R. Bertrand, D. Renaud, Ph.
Copyright Year	2001
Description	Author affiliation: Inst. of Microsystems, Swiss Fed. Inst. of Technol., Lausanne, Switzerland (Metz, S.; Heuschkel, M.O.; Valencia Avila, B.; Holzer, R.)
Abstract	This paper describes the development of microelectrodes with integrated three-dimensional electrode structures. The integration of three-dimensional structures aims at an improvement of the electrode/tissue interface. Due to the increase in surface area the electrode impedance is reduced, while the density of microelectrodes per area remains the same as with flat electrodes. Two different types of electrodes have been developed: Flexible, implantable microelectrodes with pyramidal, protruding structures and tip-shaped electrode arrays on glass substrates. The protrusion heights of the electrode sites can easily be adjusted depending on the actual application. For the flexible structures we used a polyimide-based process to fabricate microelectrodes with sharp or flat pyramidal tips and with electrode arrangements on front and backside of the devices. The tip-shaped electrode arrays were fabricated from a glass substrate by isotropic wet chemical etching and subsequent metallization and passivation. Data from impedance measurements and acute brain slice recordings indicate a considerable improvement regarding electrode impedance and obtainable signal strength.
Starting Page	765
Ending Page	768
File Size	469450
Page Count	4
File Format	PDF
ISBN	0780372115
ISSN	1094687X
DOI	10.1109/IEMBS.2001.1019053
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-10-25
Publisher Place	Turkey
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microelectrodes Electrodes Glass Surface impedance Flexible structures Chemicals Wet etching Metallization Passivation Impedance measurement
Content Type	Text
Resource Type	Article

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