NDLI: Time and temperature dependent mechanical characterization of polyimide materials in electronic packaging application

Content Provider	IEEE Xplore Digital Library
Author	Chia-Tai Kuo Ming-Chuen Yip Kuo-Ning Chiang
Copyright Year	2002
Description	Author affiliation: Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan (Chia-Tai Kuo; Ming-Chuen Yip; Kuo-Ning Chiang)
Abstract	The thermo-mechanical testing of high performance polyimide films Type HPP-ST supplied by Dupont/spl reg/ is preceded under different strain rate and temperature environment. The stress-strain behavior of materials is simulated with constitutive framework, and the dependence of Young's modulus on temperature and strain rate is reported . In view of the uncertainty of the Young's module determination, the specimens were tested with unloading-reloading to verify the test results. Constant strain rate uniaxial tensile test and long-term creep test at various temperatures are preceded to characterize the time-temperature-dependent mechanical property precisely. Cyclic loading test was also performed on the specimen to investigate cyclic stress-strain behaviors. There is no research definitely related in the past, therefore the research is expected to enhance the finite-element-modeling accuracy and characterize the material properties preciously.
Starting Page	413
Ending Page	421
File Size	779105
Page Count	9
File Format	PDF
ISBN	0780374355
DOI	10.1109/EPTC.2002.1185708
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-12-10
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature dependence Polyimides Electronics packaging Testing Capacitive sensors Thermomechanical processes Uncertainty Tensile strain Uniaxial strain Creep
Content Type	Text
Resource Type	Article

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