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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Vaynman, S. |
| Copyright Year | 1990 |
| Description | Author affiliation: BIRL, Northwestern Univ., Evanston, IL, USA (Vaynman, S.) |
| Abstract | The effect of temperature on isothermal fatigue of low-tin lead-based and lead-tin eutectic solders was studied at low strain ranges (0.3-1.0% total strain) in tests without and with hold time in the cycle. While temperature almost does not affect the fatigue life of eutectic solder, the fatigue life of low-tin lead-based solder is a complex function of temperature. Extrapolation of fatigue data for this solder was possible only in a 25 to 80 degrees C temperature range using the values of apparent activation energy from 25 to 45 kJ/mol. depending on strain range, strain rate, and presence of hold time in the cycle. Variation in the values of activation energy was found to be associated with different failure modes under various testing conditions. The higher activation energy for fatigue of low-tin lead-based solder was associated with the mixed transgranular-intergranular mode of failure. Failure in grain boundaries was characterized by lower values of activation energy. |
| Starting Page | 16 |
| Ending Page | 20 |
| File Size | 507561 |
| Page Count | 5 |
| File Format | |
| DOI | 10.1109/ITHERM.1990.113306 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1990-05-23 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Isothermal processes Fatigue Lead Capacitive sensors Testing Temperature distribution Tensile strain Electronic packaging thermal management Tin Joining materials |
| Content Type | Text |
| Resource Type | Article |
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