NDLI: Fretting corrosion studies for lead-free alloy plated contacts

Content Provider	IEEE Xplore Digital Library
Author	Ji Wu Pecht, M.
Copyright Year	2002
Description	Author affiliation: CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD, USA (Ji Wu; Pecht, M.)
Abstract	Determining the electrical characteristics of lead-free solder finishes, assessing the reliability of lead-free solder coatings while comparing their behavior to that of current tin-lead solder are necessary before implementing this material change in electronic separable connectors. Tin-lead solder alloys are the most commonly used non-noble contact finish materials in the electronic industry due to their low cost and ease of manufacturing. Since surface oxides of tin-lead alloys can be easily displaced by the mechanical deformation and wiping action of contact surfaces, low contact resistance can be easily obtained. However, a limiting factor in the use of tin-lead solder alloys separable connections is their susceptibility to fretting corrosion. Similar to tin-lead alloys, lead-free alloys are also expected to show susceptibility to fretting corrosion due to their tin content. In this study, two lead-free alloys, tin-silver-copper and tin-copper, as contact coatings, were investigated and compared with eutectic tin-lead alloy for their fretting corrosive behavior. An automatic contact resistance probe developed at the CALCE center was used to measure the contact resistance and introduce fretting corrosion. The effects on fretting corrosion at different temperatures and fretting amplitudes were examined in this study.
Starting Page	20
Ending Page	24
File Size	531590
Page Count	5
File Format	PDF
ISBN	0780374355
DOI	10.1109/EPTC.2002.1185590
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-12-10
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Corrosion Environmentally friendly manufacturing techniques Lead Contact resistance Coatings Surface resistance Tin alloys Electric variables Materials reliability Connectors
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in