NDLI: Parametric studies on temperature drops in bare chip cooling system

Content Provider	IEEE Xplore Digital Library
Author	Tomimura, T.
Copyright Year	2002
Description	Author affiliation: Inst. of Adv. Material Study, Kyushu Univ., Fukuoka, Japan (Tomimura, T.)
Abstract	A simple plate type heat spreader with high thermal conductivity is one of the promising heat transfer elements for bare chip cooling. However, so far as we know, the role of the spreader plate in the bare chip cooling system, which is composed of four layers (the chip, the heat spreader plate, a high heat conduction material and a compound), has not been made clear at all. In the present study, as a first step for proposing a correlation equation to estimate the maximum chip temperature T/sub max/, parametric studies have been carried out. From a series of numerical calculations, the effects of the thickness and the thermal conductivity of the heat spreader plate, the high heat conduction material and the compound on maximum temperature drops in each layer have been clarified.
Starting Page	299
Ending Page	303
File Size	446849
Page Count	5
File Format	PDF
ISBN	0780374355
DOI	10.1109/EPTC.2002.1185687
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-12-10
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature Thermal conductivity Heat transfer Conducting materials Heat sinks Equations Parametric study Electronics cooling Electronic components Numerical analysis
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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