NDLI: The development of enhanced wafer level packaging

Content Provider	IEEE Xplore Digital Library
Author	Wei-Chung Lo Li-Cheng Shen Shu-Ming Chang Yu-Chih Chen Hsu-Tien Hu Jyh-Rong Lin Kuo-Chuan Chen Yu-Jiau Hwang
Copyright Year	2002
Description	Author affiliation: Adv. Process Technol. Dept., APC/ERSO/lTRI, Hsinchu, Taiwan (Wei-Chung Lo; Li-Cheng Shen; Shu-Ming Chang; Yu-Chih Chen; Hsu-Tien Hu; Jyh-Rong Lin; Kuo-Chuan Chen; Yu-Jiau Hwang)
Abstract	In this paper, one of the wafer level chip scale packaging (WL-CSP) patents issued by ERSO/ITRI, the double elastomer wafer level package, is implemented on the test vehicle of Rambus DRAM to demonstrate the applicability and reliability of WL-CSP for high performance devices. In this design, both thermal and electrical performance enhancements are considered. To demonstrate the reliability of the enhanced WL-CSP, both the component- and board-level criteria are studied, which includes the evaluation of UBM (under bump metallurgy) by adopting low cost electroless and electroplating Ni/Au processes. Results show that the developed thermally and electrically enhanced WL-CSP can pass the reliability tests of pre-con, TC (temperature cycling), PCT (pressure cooker test), and HST (humidity storage test) at component-level and PCT at board-level. Although the board-level TC is on-going, which targets 1000 cycles, early studies of typical FMA are presented here. Moreover, preliminary studies of improving the board-level TC reliability are also included in the paper.
Starting Page	218
Ending Page	222
File Size	827541
Page Count	5
File Format	PDF
ISBN	0780374355
DOI	10.1109/EPTC.2002.1185671
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-12-10
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Wafer scale integration Testing Chip scale packaging Vehicles Costs Electronic packaging thermal management Buffer layers Temperature Process design Random access memory
Content Type	Text
Resource Type	Article

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