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| Content Provider | IEEE Xplore Digital Library | 
|---|---|
| Author | Anand, A. Mui, Y.C. | 
| Copyright Year | 2002 | 
| Description | Author affiliation: Adv. Micro Devices, Singapore, Singapore (Anand, A.; Mui, Y.C.) | 
| Abstract | In recent years, increasing awareness of lead-free requirement in electronics industry is driving the need to investigate lead-free solder systems in detail. This paper investigates three types of solder alloys, Sn/3.8Ag/0.7Cu, Sn/3.5Ag and Sn/0.7Cu used in a ball attache process. The scope of this paper covers lead-free solder system, comprehensively from ball attache process to board assembly reliability. This includes study on intermetallics at substrate-ball interface, PCB-ball interface, solid state diffusion study, shear force trend, failure modes and thermal cycling study of solder joints when assembled with Ni/Au and OSP finished PCBs. It was observed that the low processing temperature of Sn/3.5Ag and Sn/3.8Ag/0.7Cu make them viable lead-free alloys to implement in assembly lines. The solder life performance of these alloys is better than Sn/37Pb alloy on Ni/Au PCB but does not fare well on OSP finished PCBs. On the other hand, Sn/0.7Cu solder has a process temperature that is ten degrees above Sn/3.5Ag and Sn/3.8Ag/0.7Cu but solder life performance on Ni/Au and OSP finished PCBs fares better than other lead-free and tin-lead alloys. | 
| Starting Page | 6 | 
| Ending Page | 10 | 
| File Size | 1041815 | 
| Page Count | 5 | 
| File Format | |
| ISBN | 0780374355 | 
| DOI | 10.1109/EPTC.2002.1185588 | 
| Language | English | 
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) | 
| Publisher Date | 2002-12-10 | 
| Publisher Place | Singapore | 
| Access Restriction | Subscribed | 
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) | 
| Subject Keyword | Environmentally friendly manufacturing techniques Lead Tin Gold alloys Nickel alloys Thermal force Temperature Electronics industry Assembly systems Intermetallic | 
| Content Type | Text | 
| Resource Type | Article | 
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