NDLI: Realizing low cost and high reliability in CSP packages with surface treatment and material technology

Content Provider	IEEE Xplore Digital Library
Author	Furukawa, R.
Copyright Year	2004
Description	Author affiliation: Panasonic Factory Autom. Co., Elgin, IL, USA (Furukawa, R.)
Abstract	CSP packages are key devices that are expanding recently in the semiconductor industry. In many cases, CSP packages production has been done because of its low cost and proven results. In this case, the wire bonding electrode and solder ball attach electrode are made by the same plating process. As wire bonding electrodes become thinner, there is degradation bonding quality because the Ni compounds migrate toward Au plating surface when subjected to the heat processes. Therefore, to insure good wire bonding quality, we usually have to use thick Au plating. The larger Au weight % resulted in poor shear strength of solder ball attach. Moreover if you use electroless Au plating to get high density wiring, you have to use nickel-phosphorus rich layer at the barrier layer underneath the Au plating. In this case, phosphorus rich layer at the interface of solder bond could be detrimental to solder ball attach reliability. This has been a big problem that should be solved according by reducing the solder ball diameter. Thus there is a discrepancy in optimized Au plating thickness between the wire bonding and the solder ball attach electrode. In order to overcome this contradiction, we have developed a plasma cleaning process that can realize excellent wire bonding quality even with thin Au plating.
Sponsorship	IEEE CPMT SEMI
Starting Page	177
Ending Page	179
File Size	814012
Page Count	3
File Format	PDF
ISBN	0780385829
ISSN	10898190
DOI	10.1109/IEMT.2004.1321656
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-07-14
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Costs Materials reliability Chip scale packaging Surface treatment Materials science and technology Plasma applications Plasma materials processing Bonding Gold Wire
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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Realizing low cost and high reliability in CSP packages with surface treatment and material technology - plasma treatment technology

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