NDLI: Spray coating - a solution for resist film deposition across severe topography

Content Provider	IEEE Xplore Digital Library
Author	Fischer, K. Suss, R.
Copyright Year	2004
Description	Author affiliation: SUSS MicroTec AG, Garching, Germany (Fischer, K.; Suss, R.)
Abstract	There are situations when it is beneficial to generate lithographic patterns in, on, over or near sever topographical features >10 microns and often up to 300 microns in vertical height or depth from the wafer surface. Current spin coating approaches create unusable films with striations, streaks, pinholes and other anomalies. Dry laminated films have been used but are limited in the achievable resolution to the range of their thickness. Electroplated resists have also been considered, but are costly to deposit and limited to conductive surfaces. Finally, ordinary spray coating approaches have been attempted but seem to lack a suitable process window for production use. This paper explores a novel spray coating technology and its capability to deposit high resolution resist films on different 3D microstructures. The 3D microstructures represent the type commonly found in the field of microelectromechanical systems (MEMS), optical microelectromechanical systems (MOEMS) and backend processes (advanced packaging). In this paper the edge coverage on various structures and materials will be shown as well as the achievable uniformity on plane wafer with spray coating.
Sponsorship	IEEE CPMT SEMI
Starting Page	338
Ending Page	341
File Size	1208662
Page Count	4
File Format	PDF
ISBN	0780385829
ISSN	10898190
DOI	10.1109/IEMT.2004.1321686
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-07-14
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Spraying Coatings Resists Surface topography Optical films Microstructure Microelectromechanical systems Production Micromechanical devices Packaging
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

A model for film thickness using direct spray coating

Optimization of spray coating photoresist for high topography surfaces

Photoresist coating methods for the integration of novel 3-D RF microstructures

New photoresist coating method for high topography surfaces

Technique for preparing defect-free spray coated resist film

Photolithography on three-dimensional structures using spray coated negative and positive photoresists

Spray coating fabrication: thin film formation on non-planar surface

Extrusion-spin coating: an efficient photoresist coating process for wafers

Thin film formation-a fabrication on non-planar surface by spray coating method

Spray coating - a solution for resist film deposition across severe topography

Similar Documents

A model for film thickness using direct spray coating

Optimization of spray coating photoresist for high topography surfaces

Photoresist coating methods for the integration of novel 3-D RF microstructures

New photoresist coating method for high topography surfaces

Technique for preparing defect-free spray coated resist film

Photolithography on three-dimensional structures using spray coated negative and positive photoresists

Spray coating fabrication: thin film formation on non-planar surface

Extrusion-spin coating: an efficient photoresist coating process for wafers

Thin film formation-a fabrication on non-planar surface by spray coating method

Spray coating - a solution for resist film deposition across severe topography