NDLI: Effect of chromium-gold and titanium-titanium nitride-platinum-gold metallization on wire/ribbon bondability

Content Provider	IEEE Xplore Digital Library
Author	Jianbiao Pan Pafchek, R.M. Judd, F.F. Baxter, J.
Copyright Year	2004
Description	Author affiliation: Dept. of Ind. & Manuf. Eng., California Polytech. State Univ., San Luis Obispo, CA, USA (Jianbiao Pan)
Abstract	Gold metallization on wafer substrates for wire/ribbon bond applications require good bond strength to the substrate without weakening the wire/ribbon. This paper compares the ribbon bondability of Cr/Au and Ti/TiN/Pt/Au metallization systems. Both chromium and titanium are used to promote adhesion between substrates and sputtered gold films. Both can diffuse the gold surface after annealing and degrade the wire/ribbon bondability. Restoring bondability by ceric ammonium nitrate (CAN) etch was investigated. Experiments were conducted to investigate the effect of Cr/Au and Ti/TiN/Pt/Au, annealing, and CAN etch processes on 25.4 times; 254 /spl mu/m (1 /spl times/ 10 mil) ribbon bonding. All bonds were evaluated by noting pull strengths and examining specific failure modes. The results show that there is no significant difference in bondability between Cr/Au and Ti/TiN/Pt/Au before the annealing process. At this point excellent bond strength can be achieved. However, wire/ribbon bondability of Cr/Au degraded after the wafers are annealed. The experimental results show that a CAN etch can remove Cr oxide. Improvement of wire/ribbon bondability of Cr/Au depends on the CAN etch time. The annealing process does not have significant effect on bondability of Ti/TiN/Pt/Au metallization. Auger electron spectroscopy was used to investigate what caused the difference in bondability between the two metallization.
Sponsorship	IEEE CPMT SEMI
Starting Page	180
Ending Page	185
File Size	437735
Page Count	6
File Format	PDF
ISBN	0780385829
ISSN	10898190
DOI	10.1109/IEMT.2004.1321657
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-07-14
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Metallization Wire Gold Wafer bonding Chromium Annealing Tin Degradation Sputter etching Titanium
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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