NDLI: New flip chip technology utilizing non-conductive adhesive adapted for high volume chip card module production

Content Provider	IEEE Xplore Digital Library
Author	Pajonk, J.
Copyright Year	2004
Description	Author affiliation: DATACON Semicond. Equip. GmbH, Tirol, Austria (Pajonk, J.)
Abstract	So far, the chip-on-board (COB) has been established as the most cost-effective technique for the mass production of chip cards. Considering this, one may be surprised to know that a flip chip process was preferred to COB for a new generation of smart cards using a flex substrate. Even more surprising is the fact that the flip chip technique uses a non-conductive adhesive. It is still difficult for any flip chip process to complete with COB for such a low cost application. Also, the time needed to cure the adhesive during bonding reduces throughput dramatically. To combat these challenges, an alternative solution to the standard flip chip process using gold stud-bumps and a non-conductive paste was recently developed: it involves separating the chip bonding and curing steps. This promising technique requires specific bonding equipment where the substrate are presented in a reel-to-reel configuration and the entire process is completed within a single line. Advanced packaging equipment has been customized for this purpose. After the adhesive is dispensed, the chips are picked up and placed onto the substrate. They are then transferred to a curing station where the adhesive of several bond positions is cured at the same time. In the last step the parts are tested electrically, and the non-functioning ones are marked. This paper explains the competition between COF and FCOF techniques applied to mass production of low cost chip cards, in addition to explaining why using an NCP-based flip chip process is particularly well-suited for this type of production. We then briefly describe the bonding equipment to run this FCOF process to cost-effectively mass produce chip cards.
Sponsorship	IEEE CPMT SEMI
Starting Page	165
Ending Page	170
File Size	858492
Page Count	6
File Format	PDF
ISBN	0780385829
ISSN	10898190
DOI	10.1109/IEMT.2004.1321653
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-07-14
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Flip chip Nonconductive adhesives Bonding Mass production Costs Curing Smart cards Throughput Standards development Gold
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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