NDLI: Cost considerations for integrating flip chip and chip on board technologies into high volume manufacturing areas

Content Provider	IEEE Xplore Digital Library
Author	Roney, R.
Copyright Year	1997
Description	Author affiliation: AVEX Electron. Inc., Huntsville, AL, USA (Roney, R.)
Abstract	As die mount assembly begins to enter the high volume surface mount assembly mainstream and electronics designers and engineers begin serious discussions about converting surface mount designs to die mount assembly designs for the purposes of miniaturization or improved electrical performance, it is desirable to have a cost model which can be used to understand the cost implications. The cost for die mount assembly is impacted in three major categories: materials, assembly, and repair. In this paper, a cost model, addressing the assembly portion of the cost, is developed and partially verified. The cost model is based on a current surface mount assembly cost model and is intended to be used as a guideline for comparing the assembly cost of surface mount assemblies to the assembly cost for die mount assemblies.
Starting Page	269
Ending Page	273
File Size	411669
Page Count	5
File Format	PDF
ISBN	0780339290
ISSN	10898190
DOI	10.1109/IEMT.1997.626929
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-10-13
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Costs Flip chip Assembly Surface-mount technology Gold Temperature Electronics packaging Adders Electronic equipment testing Lead
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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