NDLI: An experimental study on organic solderability preservative

Content Provider	IEEE Xplore Digital Library
Author	Yuan Li
Copyright Year	1997
Description	Author affiliation: Exabyte Corp., Boulder, CO, USA (Yuan Li)
Abstract	Organic solderability preservatives (OSP) are regarded as an excellent pad finish for fine pitch SMT because they can produce a very thin and even coating. However, OSP coatings are more vulnerable to the thermal, humidity and physical effects compared to the HASL coating. In this study, a designed experiment was carried out to systematically study the effects of seven factors on solderability of OSP coated PCBs. These factors included PCB handling, shelf life, prebake atmosphere, dry temperature during cleaning, time delay between cleaning of the first-side misprint and re-print, and hold time between soldering operations. The results of analyzing the experiment data have shown that hold time between soldering operations is the most significant factor; prebake atmosphere when prebake is necessary, bare PCB handling, and dry temperature during cleaning of the first-side misprint are also significant; and within their selected ranges used in the experiment, shelf life, time delay between cleaning of the first-side misprint and re-print, and dry temperature during cleaning after one reflow are not significant. The effect of the water solvent used in the aqueous cleaner on the removal of the OSP coating was also quantified by an additional experiment.
Starting Page	56
Ending Page	61
File Size	527496
Page Count	6
File Format	PDF
ISBN	0780339290
ISSN	10898190
DOI	10.1109/IEMT.1997.626876
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-10-13
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Cleaning Coatings Atmosphere Delay effects Soldering Temperature distribution Surface-mount technology Humidity Data analysis Solvents
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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