NDLI: A fracture mechanics analysis of the popcorn cracking in the plastic IC packages

Content Provider	IEEE Xplore Digital Library
Author	Park, Y.B. Jin Yu
Copyright Year	1997
Description	Author affiliation: Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Seoul, South Korea (Park, Y.B.)
Abstract	Popcorn cracking phenomenon in surface mounted packages is treated by assuming an inherent edge crack at the die pad/EMC interface of a TQFP and subsequent interface delamination under thermal and/or vapor pressure loadings. Using the finite element methods and the methods of interface fracture mechanics, path independent energy release rate is calculated and compared to the interface toughness which is assumed to be a function of the phase angle. Results indicate that the edge crack propagates toward the center leading to the delamination of the entire die pad/EMC interface most notably for the vapor pressure loading, then mixed loading when thermal and vapor pressure loadings are applied simultaneously. For the thermal loading, only the cooling process is likely to lead to the entire delamination where both the energy release rate and interface toughness decrease with the crack length. For the vapor pressure loading, the energy release rate increases parabolically with the crack length but proportionally with the vapor pressure while the interface toughness remains almost constant. In the case of the mixed loading, the energy release rate increases as in the vapor pressure loading, but the interface toughness decreases with the crack length; Stress states near the crack tip were closer to mode II for thermal loading but to mode I for vapor pressure loading, and changed from mode II to mode I with the crack length for the mixed loading.
Starting Page	12
Ending Page	19
File Size	794909
Page Count	8
File Format	PDF
ISBN	0780339290
ISSN	10898190
DOI	10.1109/IEMT.1997.626866
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-10-13
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal loading Delamination Electromagnetic compatibility Thermal stresses Surface cracks Surface treatment Packaging Finite element methods Cooling Lead
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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