NDLI: Reliability qualification of a demountable packaging technology

Content Provider	IEEE Xplore Digital Library
Author	Matta, F. Afshari, B. Pendse, R. Karnezos, M.
Copyright Year	1993
Description	Author affiliation: Hewlett-Packard Co., Palo Alto, CA, USA (Matta, F.; Afshari, B.; Pendse, R.)
Abstract	Demountable TAB (or DTAB) is a detachable, solderless, IC packaging technology based on using separable pressure contacts directly between the package and the substrate (e.g. PC board). Developmental reliability testing was used as a principal tool in the engineering of DTAB. Nevertheless, upon completion of the development effort, the technology was required to pass a formal qualification with pre-set sample sizes, strife conditions, and allowable failure rates. Because of the fundamental differences between DTAB and conventional packages, new approaches were required in the design of the tests and test protocols. The qualification vehicle was a 432-lead package containing a 14-mm sq. chip and a 48-mm sq. TAB frame, both designed specifically for the purpose. The qualification program consisted of two distinct batteries of tests, one for the package, and the other for the package-to-board contacts.<>
Starting Page	679
Ending Page	685
File Size	651190
Page Count	7
File Format	PDF
ISBN	0780307941
DOI	10.1109/ECTC.1993.346776
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1993-06-01
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Qualifications Assembly Thermal stresses Integrated circuit packaging Aging Electric shock Temperature Humidity Circuit testing Costs
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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