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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Tsai-Ying Lin Tsung-Han Lin Hui-Hsiang Tung Rung-Bin Lin |
| Copyright Year | 2007 |
| Description | Author affiliation: Dept. of Comput. Sci. & Eng., Yuan Ze Univ., Chung-Li (Tsai-Ying Lin) |
| Abstract | Double-via placement is important for increasing chip manufacturing yield. Commercial tools and recent work have done a great job for it. However, they are found with a limited capability of placing more double vias (called vial) between metal 1 and metal 2. Such a limitation is caused by the way we design the standard cells and can not be resolved by developing better tools. This paper presents a double-via-driven standard cell library design approach to solving this problem. Compared to the results obtained using a commercial cell library, our library on average achieves 78% reduction in dead vias and 95% reduction in dead vials at the expense of 11% increase in total via count. We achieve these results (almost) at no extra cost in total cell area and wire length |
| Starting Page | 1 |
| Ending Page | 6 |
| File Size | 423244 |
| Page Count | 6 |
| File Format | |
| ISBN | 9783981080124 |
| DOI | 10.1109/DATE.2007.364460 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-04-16 |
| Publisher Place | France |
| Access Restriction | Subscribed |
| Rights Holder | ESCI |
| Subject Keyword | Libraries Routing Wires Pins Costs Computer science Design engineering Computer aided manufacturing Standards development Bipartite graph |
| Content Type | Text |
| Resource Type | Article |
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