NDLI: Mask assignment and synthesis of DSA-MP hybrid lithography for sub-7nm contacts/vias

Content Provider	IEEE Xplore Digital Library
Author	Badr, Y. Torres, A. Gupta, P.
Copyright Year	2015
Description	Author affiliation: Design to Silicon Div., Mentor Graphics Corp., Wilsonville, OR, USA (Torres, A.) \|\| Electr. Eng. Dept., Univ. of California, Los Angeles, Los Angeles, CA, USA (Badr, Y.; Gupta, P.)
Abstract	Integrating Directed Self Assembly (DSA) and Multiple Patterning (MP) is an attractive option for printing contact and via layers for sub-7nm process nodes. In the DSA-MP hybrid process, an optimized decomposition algorithm is required to perform the MP mask assignment while considering the DSA advantages and limitations. In this paper, we present an optimal Integer Linear Programming (ILP) formulation for the simultaneous DSA grouping and MP decomposition problem for contacts and vias. Then we propose a heuristic and develop an efficient algorithm for solving the same problem. In comparison to the optimal ILP results, the proposed algorithm is 197x faster and results in 16.3% more violations. The proposed algorithm produces 56% fewer violations than the sequential approaches which perform DSA grouping followed by MP decomposition and vice versa.
Starting Page	1
Ending Page	6
File Size	583386
Page Count	6
File Format	PDF
ISBN	9781479980529
DOI	10.1145/2744769.2744868
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-06-08
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Association for Computing Machinery, Inc. (ACM)
Subject Keyword	Lithography Ultraviolet sources Layout Heuristic algorithms Algorithm design and analysis Integer linear programming Assembly Technology Directed Self Assembly DSA Multiple Patterning MP Decomposition Moore's Law
Content Type	Text
Resource Type	Article

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