NDLI: Multiscale Orthogonal Finite-Element Reduction-Recovery method for transient analysis of integrated circuits and package problems

Content Provider	IEEE Xplore Digital Library
Author	Duo Chen Dan Jiao
Copyright Year	2010
Description	Author affiliation: School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, 47906 (Duo Chen; Dan Jiao)
Abstract	Driven by the continued advance of integrated circuit (IC) technology, large-scale electromagnetic (EM) modeling and simulation problems have been encountered across the design of on-chip circuits, package, and die-package interfaces. To give a few examples, full-chip post-layout performance verification that includes transmission line and full-wave effects, system-level signal and noise integrity analysis, and the characterization of broadband die-package interaction for clean power delivery. Two major difficulties exist for the analysis of the aforementioned large-scale problems. One is the large problem size. The modeling of a die, a package, and a combined die-package system results in numerical problems of ultra-large scale, requiring billions of parameters to describe them accurately. The other is the multiscale nature of the problem. An electromagnetic simulator is required to span scale ranges of at least 10000:1 to analyze a combined die-package system. Recently, a time domain Orthogonal Finite-Element Reduction-Recovery method (OrFE-RR) was developed to handle the large problem size associated with the design of very large-scale integrated circuits [1]. In this method, a set of orthogonal prism vector bases are developed. With this set of bases, the original ultralarge scale 3-D system of order N is rigorously reduced to a 2-D single-layered system of order M with negligible computational cost, where M is much less than N. The reduced 2D system is diagonal, and hence can be solved readily. After obtaining the solution of the reduced system, the rest of the solutions can be recovered in linear complexity. This method entails no theoretical approximation. It applies to any arbitrarily-shaped multilayer structure involving inhomogeneous materials. Numerical experiments have demonstrated its accuracy and capacity in simulating very large-scale on-chip, package, and die-package interaction problems. The multiscaled nature of the integrated circuit system has not been addressed in the OrFE-RR method. The method projects the meshes in all the layers to the same layer. Namely, all the layers share the same mesh. This results in redundant mesh elements, and hence redundant number of unknowns. In this work, we extend the OrFE-RR method to model the orders-of-magnitude difference in scale of the die and the package by developing a multiscale modeling scheme. With such a scheme, we allow for the use of different mesh sizes in different layers and regions. As a result, we do not need to project the meshes in different layers to the same layer. In addition, we permit the modeling of the orders-of-magnitude difference in scale of a physical structure by using the minimum number of mesh elements.
Starting Page	1
Ending Page	4
File Size	659466
Page Count	4
File Format	PDF
ISBN	9781424449675
ISSN	15223965
DOI	10.1109/APS.2010.5561920
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-07-11
Publisher Place	Canada
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit modeling Boundary conditions Finite element methods Time domain analysis System-on-a-chip Numerical models
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Time-Domain Orthogonal Finite-Element Reduction-Recovery Method for Electromagnetics-Based Analysis of Large-Scale Integrated Circuit and Package Problems

Electromagnetics-based co-simulation of linear network and nonlinear circuits accelerated by time-domain orthogonal finite-element reduction-recovery method

Time-Domain Orthogonal Finite-Element Reduction-Recovery Method for Electromagnetics-Based Analysis of Large-Scale Integrated Circuit and Package Problems

A fast-marching time-domain layered finite-element reduction-recovery method for high-frequency VLSI design

Hierarchical Finite-Element Reduction-Recovery Method for Large-Scale Transient Analysis of High-Speed Integrated Circuits

Time-domain orthogonal finite-element reduction-recovery (OrFE-RR) method for fast and accurate broadband simulation of die-package interaction

Three finite-element time-domain-based numerical algorithms for high-frequency broadband PCB simulations

An unconditionally stable time-domain finite element method of significantly reduced computational complexity for large-scale simulation of IC and package problems

On-Chip Interconnects Modeling in Time-Domain using the Explicit DuFort-Frankel Algorithm

Multiscale Orthogonal Finite-Element Reduction-Recovery method for transient analysis of integrated circuits and package problems

Similar Documents

Time-Domain Orthogonal Finite-Element Reduction-Recovery Method for Electromagnetics-Based Analysis of Large-Scale Integrated Circuit and Package Problems

Electromagnetics-based co-simulation of linear network and nonlinear circuits accelerated by time-domain orthogonal finite-element reduction-recovery method

Time-Domain Orthogonal Finite-Element Reduction-Recovery Method for Electromagnetics-Based Analysis of Large-Scale Integrated Circuit and Package Problems

A fast-marching time-domain layered finite-element reduction-recovery method for high-frequency VLSI design

Hierarchical Finite-Element Reduction-Recovery Method for Large-Scale Transient Analysis of High-Speed Integrated Circuits

Time-domain orthogonal finite-element reduction-recovery (OrFE-RR) method for fast and accurate broadband simulation of die-package interaction

Three finite-element time-domain-based numerical algorithms for high-frequency broadband PCB simulations

An unconditionally stable time-domain finite element method of significantly reduced computational complexity for large-scale simulation of IC and package problems

On-Chip Interconnects Modeling in Time-Domain using the Explicit DuFort-Frankel Algorithm

Multiscale Orthogonal Finite-Element Reduction-Recovery method for transient analysis of integrated circuits and package problems