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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Duan, S.L. Artman, J.O. Wong, B. Laughlin, D.E. |
| Copyright Year | 1965 |
| Abstract | Thin CoNiCr/Cr films (candidates for longitudinal recording media) were deposited on Corning 7059 glass substrate by RF diode sputtering. The CoNiCr layer thickness was fixed at 40 nm; the Cr layer thickness, d/sub Cr/, ranged between 60 and 400 nm. At d/sub Cr/=170 nm, when the substrate temperature before deposition, T/sub s/, was set below 100 degrees C, both the Cr underlayer and the CoNiCr layer were more or less randomly oriented. When specimens were deposited at T/sub s/>or=200 degrees C, the Cr layer was strongly [100] textured and the CoNiCr layer exhibited a strongly preferred texture. This CoNiCr texture is epitaxially favored by the Cr [100] texture. With increasing d/sub Cr/ the Cr [110] texture increased and the CoNiCr texture decreased. The grain size increased with T/sub s/ and d/sub Cr/. In-plane coercivity, H/sub c/, initially increased with T/sub s/ to peak at T/sub s/=200 degrees C. As T/sub s/ was increased further from 200 to 260 degrees C, H/sub c/ decreased. The squareness and saturation magnetization were not sensitive to T/sub s/.< |
| Sponsorship | IEEE Magnetics Society |
| Starting Page | 1587 |
| Ending Page | 1589 |
| Page Count | 3 |
| File Size | 353517 |
| File Format | |
| ISSN | 00189464 |
| Volume Number | 26 |
| Issue Number | 5 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1990-09-01 |
| Publisher Place | U.S.A. |
| Access Restriction | One Nation One Subscription (ONOS) |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Microstructure Magnetic properties Chromium Substrates Magnetic films Magnetic recording Glass Radio frequency Diodes Sputtering |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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