NDLI: Annealing Temperature Effect on the Structure of High Thermal Conductivity Silver/Epoxy Nanocomposites

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Pashayi, Kamyar Fard, Hafez Raeisi Lai, Fengyuan Plawsky, Joel Borca-Tasciuc, Theodorian
Copyright Year	2011
Abstract	The thermal conductivity κ of polymer nanoparticle composites is typically <10 Wm−1K−1, even when high κ nanofillers are employed, due to the thermal interface resistance between nanoparticles and the polymer matrix1 or the absence of high thermal conductivity pathways. We recently demonstrated high κ in bulk nanocomposites of silver nanoparticles dispersed in epoxy and cured at low temperature (150 °C). A nanocomposite with 30 vol. % 20nm particles exhibited κ ∼30 Wm−1K−1.2 The mechanism responsible for enhancing κ was found to be the self-construction, through in-situ sintering, of high aspect ratio metallic networks inside the nanocomposite.2 In order to control and optimize the network structure and subsequently increase κ even further, this work focuses on studying the effects of curing temperature and nanoparticle surface coating on the structure of the nanocomposite.
Starting Page	713
Ending Page	714
Page Count	2
File Format	PDF
ISBN	9780791854976
DOI	10.1115/IMECE2011-65578
Volume Number	Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration
Conference Proceedings	ASME 2011 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2011-11-11
Publisher Place	Denver, Colorado, USA
Access Restriction	Subscribed
Subject Keyword	Epoxy adhesives Annealing Temperature Construction Coatings Nanoparticles Silver Composite materials Nanocomposites Epoxy resins Particulate matter Sintering Thermal conductivity Coating processes Polymers Hardening (curing) Low temperature
Content Type	Text
Resource Type	Article

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