NDLI: Molecular Dynamics of Crack Growth in Nickel and Nickel-Aluminum Bi-Metallic Interface System Under Cyclic Loading

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Purohit, Yojna Mohan, Ram
Copyright Year	2011
Abstract	Molecular dynamics simulations using embedded atom method inter-atomic potential were used to study crack propagation under cyclic loading in a Ni single crystal and a Ni-Al bi-metallic system. The crack in Ni-Al initiates and propagates from Ni towards the Ni-Al interface. The cyclic loading was applied in a strain controlled manner with constant amplitude of maximum strains (emax) applied to the two systems. The crack growth and propagation mechanism of a crack propagating in Ni were compared with the crack growth and propagation of a surface crack in Ni-Al at two different values of emax. Our results suggest that depending on the maximum value of the applied strain (emax), the crack propagates either by fatigue cleavage of the atomic bonds in the crack plane or by void nucleation in the regions near the crack tip. The creation of voids slows down crack growth in both the Ni and Ni-Al at higher value of emax. A comparison of crack growth under tensile and cyclic loading (emax, 0.046) suggest that plastic deformation around crack tip dominate crack propagation during tensile loading that result in slower crack growth (due to early nucleation of dislocations at the crack tip), when compared to crack growth under cyclic loading.
Starting Page	693
Ending Page	702
Page Count	10
File Format	PDF
ISBN	9780791854976
DOI	10.1115/IMECE2011-65150
Volume Number	Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration
Conference Proceedings	ASME 2011 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2011-11-11
Publisher Place	Denver, Colorado, USA
Access Restriction	Subscribed
Subject Keyword	Deformation Aluminum Crystals Molecular dynamics Atoms Fatigue Fracture (materials) Molecular dynamics simulation Crack propagation Nucleation (physics) Dislocations Nickel Surface cracks
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in