NDLI: Device Packaging Techniques for Implementing a Novel Thermal Flux Method for Fluid Degassing and Charging of a Planar Microscale Loop Heat Pipe

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Navdeep, S. Dhillon Jim, C. Cheng Albert, P. Pisano
Copyright Year	2011
Abstract	A novel two-port thermal flux method is implemented for degassing a microscale loop heat pipe (mLHP) and charging it with a working fluid. The mLHP is fabricated on a silicon wafer using standard MEMS micro-fabrication techniques, and capped by a Pyrex wafer, using anodic bonding. For these devices, small volumes and large capillary forces render conventional vacuum pump-based methods quite impractical. Instead, we employ thermally generated pressure gradients to purge non-condensible gases from the device, by vapor convection. Three different, high-temperature-compatible, MEMS device packaging techniques have been studied and implemented, in order to evaluate their effectiveness and reliability. The first approach uses O-rings in a mechanically sealed plastic package. The second approach uses an aluminum double compression fitting assembly for alignment, and soldering for establishing the chip-to-tube interconnects. The third approach uses a high temperature epoxy to hermetically embed the device in a machined plastic base package. Using water as the working fluid, degassing and filling experiments are conducted to verify the effectiveness of the thermal flux method.
Starting Page	963
Ending Page	971
Page Count	9
File Format	PDF
ISBN	9780791854976
DOI	10.1115/IMECE2011-64944
Volume Number	Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration
Conference Proceedings	ASME 2011 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2011-11-11
Publisher Place	Denver, Colorado, USA
Access Restriction	Subscribed
Subject Keyword	Epoxy adhesives Water Compression Temperature Microscale devices Aluminum Vapors Semiconductor wafers High temperature Pressure gradient Heat flux Convection Fluids Vacuum Microfabrication Epoxy resins Borosilicate glasses Manufacturing Bonding Microelectromechanical systems Gases Fittings Pumps Heat pipes Seals Packaging Reliability Soldering
Content Type	Text
Resource Type	Article

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